meta-digi/meta-digi-arm
Gabriel Valcazar 1ce17da864 imx-boot: fix ccimx8x builds when Trustfence is enabled
Make a series of changes to make sure the imx-boot signing process works:

    * Store separate mkimage logs for each imx-boot build. In our case, this
      means storing one log per SoC revision. Each SoC revision has a different
      SECO fw binary with varying sizes, which causes offsets of specific
      signing regions to differ among revisions. Since we parse the offsets
      from the logs, we need to make sure the offset information is correct in
      each case.
    * Remove u-boot-atf-container.img in each mkimage iteration, otherwise the
      ATF offset information will be missing from subsequent logs.
    * Implement a separate trustfence_sign_imxboot() function for the ccimx8x
      to iterate through all SoC revisions.

Note that the SPL+AHAB signing script doesn't support imx-boot encryption yet.

Signed-off-by: Gabriel Valcazar <gabriel.valcazar@digi.com>
2023-07-10 11:09:37 +02:00
..
classes trustfence: image_types: do not sign artifacts for STM platforms 2023-05-10 17:33:23 +02:00
conf optee: update to NXP's lf-6.1.22-2.0.0 release for ccimx93 2023-07-07 12:22:56 +02:00
custom-licenses kirkstone migration: cosmetic, clean build warnings 2022-06-21 16:49:56 +02:00
dynamic-layers imx-boot: fix ccimx8x builds when Trustfence is enabled 2023-07-10 11:09:37 +02:00
recipes-bsp firmware_qualcomm: remove BDF symlinks 2023-07-07 15:55:46 +02:00
recipes-connectivity/nxp-wlan-sdk nxp-wlan-sdk: update to version lf-6.1.22 2023-07-07 02:04:16 +02:00
recipes-core udev: dualboot: include linux_a/b to partitions to be mounted as ro 2023-06-07 16:36:54 +02:00
recipes-digi trustfence-sign-tools: use appropriate signing script when using SPL and AHAB 2023-07-10 11:09:37 +02:00
recipes-kernel linux-dey: update branch for version 6.1 recipe 2023-07-07 12:22:55 +02:00
DIGI_EULA DIGI_EULA: Update Digi EULA file. 2017-08-29 12:23:22 +02:00
DIGI_OPEN_EULA meta-digi-arm: Add end user license agreements. 2012-10-26 16:20:14 +02:00
README meta-digi: update support email address 2017-10-30 17:02:33 +01:00

README

OpenEmbedded/Yocto BSP layer for Digi's ConnectCore platforms
=============================================================

This layer provides support for Digi's ConnnecCore platforms for use
with OpenEmbedded and/or Yocto.

This layer depends on:

git://git.yoctoproject.org/poky.git
git://git.openembedded.org/meta-openembedded.git
git://git.yoctoproject.org/meta-freescale.git

Digi's license agreements
-------------------------

All software is covered by Digi's general EULA and Digi's Open Source
EULA. To have the right to use the software in your images you need to
read and accept both EULAs at the DIGI_EULA and DIGI_OPEN_EULA files.

NXP Semiconductors' software license agreement
----------------------------------------------

Some platforms depends on libraries and packages that are covered by
NXP Semiconductors' EULA. To have the right to use those binaries in
your images you need to read and accept the EULA file in meta-freescale
Yocto layer.

Support
-------

This layer is provided 'as is' with no guarantee. However, some support
may be available from tech.support@digi.com