meta-digi/meta-digi-arm
Arturo Buzarra 22429e62cb meta-digi-arm: add support for Worldwide regulatory domains
- For Qualcomm QCA65x4 platforms:

Add support to create the 'World' board data file for the QCA65x4 Wi-Fi
chip to operate on World regulatory domain.

Kernel wireless driver already supports selecting the correct file based
on the configured Regulatory Domain via Kernel command line argument
'wlan.regdmn', which allows the following parameters:
  * "US", for U.S.A. (default)
  * "World", for worldwide

- For Murata type2AE platforms:

Add World CLM blob file for the wireless interface and JRL hcd file for
the Bluetooth interface. Also add the autocountry ininitialization script
and systemd service.

World CLM blob file:
  - cyfmac4373-sdio_World.clm_blob (1abe7f3fa86d4123b0586cbbf0ec91ac)

Kernel wireless and bluetooth drivers already support selecting the correct
files based on the configured Regulatory Domain via Kernel command line
arguments 'brcmfmac.regdmn' and 'btbcm.regdmn' respectively, which allow the
following parameters:
  'brcmfmac.regdmn':
    * "US", for U.S.A. (default)
    * "World", for worldwide

  'btbcm.regdmn':
    * "FCC.CE", for U.S.A., Europe and the rest of the world (default)
    * "JRL", for Japan

https://onedigi.atlassian.net/browse/DEL-8905

Co-authored-by: Gonzalo Ruiz <Gonzalo.Ruiz@digi.com>
Signed-off-by: Arturo Buzarra <arturo.buzarra@digi.com>
2024-03-21 09:12:25 +01:00
..
classes trustfence: rename variables related to FIT image signing 2024-03-19 13:26:47 +01:00
conf meta-digi-arm: add support for Worldwide regulatory domains 2024-03-21 09:12:25 +01:00
custom-licenses kirkstone migration: cosmetic, clean build warnings 2022-06-21 16:49:56 +02:00
dynamic-layers Merge tag 'dey-4.0-r5.2' into dey-4.0/master 2024-02-16 12:59:43 +01:00
recipes-bsp meta-digi-arm: add support for Worldwide regulatory domains 2024-03-21 09:12:25 +01:00
recipes-connectivity/nxp-wlan-sdk ccimx93: iw61x: update package for NXP release 6.1.55-2.2.0 2023-12-21 17:56:11 +01:00
recipes-core read only: fix problem when mounting external devices 2024-01-09 16:36:20 +01:00
recipes-digi meta-digi: support SRK revocation mask when signing boot artifacts 2024-03-12 18:12:56 +01:00
recipes-kernel trustfence: rename variables related to FIT image signing 2024-03-19 13:26:47 +01:00
wic ccmp1: support different DDR3 configurations 2024-02-20 15:34:58 +01:00
DIGI_EULA DIGI_EULA: Update Digi EULA file. 2017-08-29 12:23:22 +02:00
DIGI_OPEN_EULA meta-digi-arm: Add end user license agreements. 2012-10-26 16:20:14 +02:00
README meta-digi: update support email address 2017-10-30 17:02:33 +01:00

README

OpenEmbedded/Yocto BSP layer for Digi's ConnectCore platforms
=============================================================

This layer provides support for Digi's ConnnecCore platforms for use
with OpenEmbedded and/or Yocto.

This layer depends on:

git://git.yoctoproject.org/poky.git
git://git.openembedded.org/meta-openembedded.git
git://git.yoctoproject.org/meta-freescale.git

Digi's license agreements
-------------------------

All software is covered by Digi's general EULA and Digi's Open Source
EULA. To have the right to use the software in your images you need to
read and accept both EULAs at the DIGI_EULA and DIGI_OPEN_EULA files.

NXP Semiconductors' software license agreement
----------------------------------------------

Some platforms depends on libraries and packages that are covered by
NXP Semiconductors' EULA. To have the right to use those binaries in
your images you need to read and accept the EULA file in meta-freescale
Yocto layer.

Support
-------

This layer is provided 'as is' with no guarantee. However, some support
may be available from tech.support@digi.com