meta-digi/meta-digi-arm
Hector Palacios 32f4ba9b6d tf-a-stm32mp: obtain password to use during FIP image signing process
The FIP image is signed internally by this recipe. The password must be
set in FIP_SIGN_KEY_PASS. With the signing script, the password is
randomly generated and saved in key_pass.txt.
This prefunc obtains the password(s) from the file to set FIP_SIGN_KEY_PASS
so that the FIP can be properly signed.

Signed-off-by: Hector Palacios <hector.palacios@digi.com>
2023-05-10 17:33:23 +02:00
..
classes trustfence: image_types: do not sign artifacts for STM platforms 2023-05-10 17:33:23 +02:00
conf global: create DIGI_SOM variable and reformulate DIGI_FAMILY variable 2023-05-10 17:33:23 +02:00
custom-licenses kirkstone migration: cosmetic, clean build warnings 2022-06-21 16:49:56 +02:00
dynamic-layers tf-a-stm32mp: obtain password to use during FIP image signing process 2023-05-10 17:33:23 +02:00
recipes-bsp trustfence: image_types: do not sign artifacts for STM platforms 2023-05-10 17:33:23 +02:00
recipes-connectivity/nxp-wlan-sdk nxp-wlan-sdk: iw612-sdk: add nxp tools 2023-04-20 17:05:00 +02:00
recipes-core trustfence-sign-tools: make dependency of cst-tool NXP-specific 2023-05-10 17:33:23 +02:00
recipes-digi trustfence: add recipe to generate the PKI tree 2023-05-10 17:33:23 +02:00
recipes-kernel trustfence: image_types: do not sign artifacts for STM platforms 2023-05-10 17:33:23 +02:00
DIGI_EULA DIGI_EULA: Update Digi EULA file. 2017-08-29 12:23:22 +02:00
DIGI_OPEN_EULA meta-digi-arm: Add end user license agreements. 2012-10-26 16:20:14 +02:00
README meta-digi: update support email address 2017-10-30 17:02:33 +01:00

README

OpenEmbedded/Yocto BSP layer for Digi's ConnectCore platforms
=============================================================

This layer provides support for Digi's ConnnecCore platforms for use
with OpenEmbedded and/or Yocto.

This layer depends on:

git://git.yoctoproject.org/poky.git
git://git.openembedded.org/meta-openembedded.git
git://git.yoctoproject.org/meta-freescale.git

Digi's license agreements
-------------------------

All software is covered by Digi's general EULA and Digi's Open Source
EULA. To have the right to use the software in your images you need to
read and accept both EULAs at the DIGI_EULA and DIGI_OPEN_EULA files.

NXP Semiconductors' software license agreement
----------------------------------------------

Some platforms depends on libraries and packages that are covered by
NXP Semiconductors' EULA. To have the right to use those binaries in
your images you need to read and accept the EULA file in meta-freescale
Yocto layer.

Support
-------

This layer is provided 'as is' with no guarantee. However, some support
may be available from tech.support@digi.com