meta-digi/meta-digi-arm
Hector Bujanda f3bf3c7504 linux-libc-headers: patch SDK gpio.h file with Digi debounce IOCTL
Digi customized linux kernel gpio.h file to allow debounce functionality by the
user space through the character device.
This commit patches the default gpio.h file that is used to generate the SDK
(which comes from kernel 4.18) with Digi debounce additions.

https://jira.digi.com/browse/DEL-7027

Signed-off-by: Hector Bujanda <hector.bujanda@digi.com>
2020-04-21 16:18:46 +02:00
..
classes trustfence: Export variables that are needed by sign tools. 2020-02-12 18:50:19 +01:00
conf trustfence: Add U-Boot sign support for ccimx8mn 2020-04-08 14:23:18 +02:00
custom-licenses recipes-digi: add cryptoauth-openssl-engine 2018-05-09 09:16:00 +02:00
recipes-bsp trustfence: Add U-Boot sign support for ccimx8mn 2020-04-08 14:23:18 +02:00
recipes-core udev-extraconf: create /dev/ttyXBee symlink to XBee uart 2020-01-15 18:05:48 +01:00
recipes-cpu/m4-demos imx-m4-demos: sync with meta-fsl-bsp-release branch sumo-4.14.98-2.3.0 2020-01-16 13:27:54 +01:00
recipes-devtools/imx-usb-loader imx-usb-loader: use the version that was used in older versions of DEY 2019-04-04 17:42:46 +02:00
recipes-digi trustfence: Add U-Boot sign support for ccimx8mn 2020-04-08 14:23:18 +02:00
recipes-kernel linux-libc-headers: patch SDK gpio.h file with Digi debounce IOCTL 2020-04-21 16:18:46 +02:00
DIGI_EULA DIGI_EULA: Update Digi EULA file. 2017-08-29 12:23:22 +02:00
DIGI_OPEN_EULA meta-digi-arm: Add end user license agreements. 2012-10-26 16:20:14 +02:00
README meta-digi: update support email address 2017-10-30 17:02:33 +01:00

README

OpenEmbedded/Yocto BSP layer for Digi's ConnectCore platforms
=============================================================

This layer provides support for Digi's ConnnecCore platforms for use
with OpenEmbedded and/or Yocto.

This layer depends on:

git://git.yoctoproject.org/poky.git
git://git.openembedded.org/meta-openembedded.git
git://git.yoctoproject.org/meta-freescale.git

Digi's license agreements
-------------------------

All software is covered by Digi's general EULA and Digi's Open Source
EULA. To have the right to use the software in your images you need to
read and accept both EULAs at the DIGI_EULA and DIGI_OPEN_EULA files.

NXP Semiconductors' software license agreement
----------------------------------------------

Some platforms depends on libraries and packages that are covered by
NXP Semiconductors' EULA. To have the right to use those binaries in
your images you need to read and accept the EULA file in meta-freescale
Yocto layer.

Support
-------

This layer is provided 'as is' with no guarantee. However, some support
may be available from tech.support@digi.com