meta-digi/meta-digi-arm
Gonzalo Ruiz 440c3a953a qualcomm.sh: generalize to select correct board data file
Generalize script to select the correct board data file to load into the
wireless chip depending on the Regulatory Domain configuration whether it
is a variation of 'bdwlan30.bin' or 'fakeboar.bin'.

If 'bdwlan30_US.bin' or 'bdwlan30_World.bin' files are found in the firmware
directory, the script will create two symlinks, 'bdwlan30.bin and 'utfbd30.bin',
pointing to either one of those files.

If no 'bdwlan30_*.bin' files are found, but 'fakeboar_US.bin' or
'fakeboar_World.bin' is, it will create a single symlink, 'fakeboar.bin',
pointing to either one of those files. In the case a QCA6574 community driver
is loaded, 'board.bin' symlink will be updated.

If no 'fakeboard_*.bin' files are found either, the script will exit.

https://jira.digi.com/browse/DEL-6773

Signed-off-by: Gonzalo Ruiz <Gonzalo.Ruiz@digi.com>
2019-10-02 17:32:04 +02:00
..
classes fsl-eula-unpack: sync with meta-fsl-bsp-release branch sumo-4.14.98-2.1.0 2019-09-02 09:43:15 +02:00
conf Merge branch 'dey-2.6/master' into dey-2.6/maint 2019-09-03 13:17:56 +02:00
custom-licenses recipes-digi: add cryptoauth-openssl-engine 2018-05-09 09:16:00 +02:00
recipes-bsp meta-digi: revert revisions to AUTOREV 2019-09-26 18:16:54 +02:00
recipes-core udev-extraconf: mount.sh with skip of already-mounted partitions 2019-09-18 09:13:41 +02:00
recipes-cpu/m4-demos imx-m4-demos: update to v2.5.2 2019-05-15 10:35:13 +02:00
recipes-devtools/imx-usb-loader imx-usb-loader: use the version that was used in older versions of DEY 2019-04-04 17:42:46 +02:00
recipes-digi meta-digi: revert revisions to AUTOREV 2019-09-26 18:16:54 +02:00
recipes-kernel qualcomm.sh: generalize to select correct board data file 2019-10-02 17:32:04 +02:00
DIGI_EULA DIGI_EULA: Update Digi EULA file. 2017-08-29 12:23:22 +02:00
DIGI_OPEN_EULA meta-digi-arm: Add end user license agreements. 2012-10-26 16:20:14 +02:00
README meta-digi: update support email address 2017-10-30 17:02:33 +01:00

README

OpenEmbedded/Yocto BSP layer for Digi's ConnectCore platforms
=============================================================

This layer provides support for Digi's ConnnecCore platforms for use
with OpenEmbedded and/or Yocto.

This layer depends on:

git://git.yoctoproject.org/poky.git
git://git.openembedded.org/meta-openembedded.git
git://git.yoctoproject.org/meta-freescale.git

Digi's license agreements
-------------------------

All software is covered by Digi's general EULA and Digi's Open Source
EULA. To have the right to use the software in your images you need to
read and accept both EULAs at the DIGI_EULA and DIGI_OPEN_EULA files.

NXP Semiconductors' software license agreement
----------------------------------------------

Some platforms depends on libraries and packages that are covered by
NXP Semiconductors' EULA. To have the right to use those binaries in
your images you need to read and accept the EULA file in meta-freescale
Yocto layer.

Support
-------

This layer is provided 'as is' with no guarantee. However, some support
may be available from tech.support@digi.com