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meta-digi/meta-digi-arm
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Hector Palacios 4f33afcbcf trustfence: split ccmp13 passwords in 8 files and set SWUPDATE keys 
For signing SWU files we need to set a couple of variables:
 - SWUPDATE_PRIVATE_KEY_TEMPLATE to the private key file
 - SWUPDATE_PASSWORD_FILE to the password of the private key

The latter must only contain one password, whereas the current key_pass.txt
file had (for the ccmp13) the eight keys separated by a white space.

This commit:
 - If the file key_pass.txt exists, it extracts each key into a separate
   file key_pass0X.txt.
 - If the keys don't exist, generates separate files per key.
 - Changes the permissions of password files to 400.
 - Adapts the sign script to use the single password files.
 - Fixes a few quotes

Signed-off-by: Hector Palacios <hector.palacios@digi.com>
 		2024-01-03 13:05:05 +01:00
..
classes ccmp1: add signed FIT image support 2023-10-30 12:58:19 +01:00
conf optee: update to NXP's lf-6.1.55-2.2.0 release for ccimx93 2024-01-03 12:00:07 +01:00
custom-licenses kirkstone migration: cosmetic, clean build warnings 2022-06-21 16:49:56 +02:00
dynamic-layers ccimx93: support building bootloader for soc revision A0 2024-01-03 12:00:07 +01:00
recipes-bsp uboot: ccmp1: disable LEGACY_IMAGE_FORMAT when FIT enabled 2023-11-28 19:04:22 +01:00
recipes-connectivity/nxp-wlan-sdk ccimx93: iw61x: update package for NXP release 6.1.55-2.2.0 2023-12-21 17:56:11 +01:00
recipes-core dualboot: avoid the mount of alternative rootfs partition 2023-11-13 17:23:06 +01:00
recipes-digi trustfence: split ccmp13 passwords in 8 files and set SWUPDATE keys 2024-01-03 13:05:05 +01:00
recipes-kernel linux-dey: update to NXP's lf-6.1.55-2.2.0 release for ccimx93 2023-12-21 17:57:16 +01:00
wic ccmp1: add wks file to generate a bootable sdcard 2023-07-31 11:51:16 +02:00
DIGI_EULA DIGI_EULA: Update Digi EULA file. 2017-08-29 12:23:22 +02:00
DIGI_OPEN_EULA meta-digi-arm: Add end user license agreements. 2012-10-26 16:20:14 +02:00
README meta-digi: update support email address 2017-10-30 17:02:33 +01:00

README 

OpenEmbedded/Yocto BSP layer for Digi's ConnectCore platforms
=============================================================

This layer provides support for Digi's ConnnecCore platforms for use
with OpenEmbedded and/or Yocto.

This layer depends on:

git://git.yoctoproject.org/poky.git
git://git.openembedded.org/meta-openembedded.git
git://git.yoctoproject.org/meta-freescale.git

Digi's license agreements
-------------------------

All software is covered by Digi's general EULA and Digi's Open Source
EULA. To have the right to use the software in your images you need to
read and accept both EULAs at the DIGI_EULA and DIGI_OPEN_EULA files.

NXP Semiconductors' software license agreement
----------------------------------------------

Some platforms depends on libraries and packages that are covered by
NXP Semiconductors' EULA. To have the right to use those binaries in
your images you need to read and accept the EULA file in meta-freescale
Yocto layer.

Support
-------

This layer is provided 'as is' with no guarantee. However, some support
may be available from tech.support@digi.com