meta-digi/meta-digi-arm
Arturo Buzarra 5bc574a8e9 kernel-module-qualcomm: update recipe to use new qcacld-3.0 Linux wireless driver
This commit updates the Linux wireless driver for Qualcomm's chipset to the
new qcacld-3.0 driver.
This update is based on the release "r10016.1 - Post-CS3 1.0.016.1" from
"qca6574au-le-2-2-1_qca_oem" product branch, which uses for a Linux kernel v5.4
the tag "CHSS.LNX_FSL.5.0-01200-QCA6574AUARMSDIOHZ".

https://onedigi.atlassian.net/browse/DEL-7916

Signed-off-by: Arturo Buzarra <arturo.buzarra@digi.com>
2022-05-19 13:36:28 +02:00
..
classes image_types: fix do_image_boot_ubifs() for ConnectCore MP15 platform 2022-05-10 11:29:12 +02:00
conf meta-digi-arm: fix typo in dynamic-layers for NXP platform 2022-05-12 17:34:07 +02:00
custom-licenses recipes-digi: add cryptoauth-openssl-engine 2018-05-09 09:16:00 +02:00
dynamic-layers/freescale-layer imx-boot: fix include path with dynamic layer 2022-05-12 17:34:07 +02:00
recipes-bsp firmware-murata: new recipe to manage firmware binaries to Murata wireless chips 2022-05-10 10:56:22 +02:00
recipes-core udev: move recipes into dynamic-layers for NXP 2022-05-04 14:01:05 +02:00
recipes-digi mca-tool: add mca-tool support for CCMP15 2022-05-04 14:01:05 +02:00
recipes-kernel kernel-module-qualcomm: update recipe to use new qcacld-3.0 Linux wireless driver 2022-05-19 13:36:28 +02:00
DIGI_EULA DIGI_EULA: Update Digi EULA file. 2017-08-29 12:23:22 +02:00
DIGI_OPEN_EULA meta-digi-arm: Add end user license agreements. 2012-10-26 16:20:14 +02:00
README meta-digi: update support email address 2017-10-30 17:02:33 +01:00

README

OpenEmbedded/Yocto BSP layer for Digi's ConnectCore platforms
=============================================================

This layer provides support for Digi's ConnnecCore platforms for use
with OpenEmbedded and/or Yocto.

This layer depends on:

git://git.yoctoproject.org/poky.git
git://git.openembedded.org/meta-openembedded.git
git://git.yoctoproject.org/meta-freescale.git

Digi's license agreements
-------------------------

All software is covered by Digi's general EULA and Digi's Open Source
EULA. To have the right to use the software in your images you need to
read and accept both EULAs at the DIGI_EULA and DIGI_OPEN_EULA files.

NXP Semiconductors' software license agreement
----------------------------------------------

Some platforms depends on libraries and packages that are covered by
NXP Semiconductors' EULA. To have the right to use those binaries in
your images you need to read and accept the EULA file in meta-freescale
Yocto layer.

Support
-------

This layer is provided 'as is' with no guarantee. However, some support
may be available from tech.support@digi.com