meta-digi/meta-digi-arm
Hector Palacios 61eb1bfbe6 tf-a-stm32mp: create symlinks to TF-A artifacts in subfolders
The following TF-A artifacts are deployed to subdirectories of
the image deploydir:
  - arm-trusted-firmware/tf-a-<platform>-<bootconfig>.stm32
  - arm-trusted-firmware/metadata-<platform>.bin
  - fip/fip-<platform>-<bootconfig>.bin
  - fip/fip-<platform>-ddr-<bootconfig>.bin

These binaries are not copied to the image deploy dir during
the regular do_deploy(), instead, they are deployed by script
tf_a_sysroot_populate() which is added to SYSROOT_PREPROCESS_FUNCS.

To follow this logic, change the previously wrong do_deploy:append
into a new function and append it also to SYSROOT_PREPROCESS_FUNCS,
so that it is called after the artifacts have really been deployed.

In the existing code, fix the paths and commands, which had some
errors.

Signed-off-by: Hector Palacios <hector.palacios@digi.com>

https://onedigi.atlassian.net/browse/DEL-9461
2025-01-31 09:10:21 +01:00
..
classes stm-st-stm32mp: remove outdated recipes and unnecessary files 2024-12-10 10:19:50 +01:00
conf ccimx91-dvk.conf: use SoM-specific override to set SECO_FIRMWARE_NAME 2025-01-30 17:32:30 +01:00
custom-licenses kirkstone migration: cosmetic, clean build warnings 2022-06-21 16:49:56 +02:00
dynamic-layers tf-a-stm32mp: create symlinks to TF-A artifacts in subfolders 2025-01-31 09:10:21 +01:00
recipes-bsp digi-sc-firmware: update to v1.17.0.2 2024-12-20 12:36:04 +01:00
recipes-connectivity/nxp-wlan-sdk freescale-layer: nxp-wlan-sdk: sync with meta-imx scarthgap-6.6.23-2.0.0 2024-10-17 13:03:37 +02:00
recipes-core udev-extraconf: cc9/iw61x: skip actions for wifi card 2025-01-27 11:00:29 +01:00
recipes-digi trustfence-sign-artifact: fix AHAB-containerizing command for ccimx91 2024-11-20 18:57:24 +01:00
recipes-kernel linux-dey: update imx branch for release lf-6.6.52-2.2.0 2024-12-16 11:02:39 +01:00
wic sdcard: add support to create sdcard image for CCMP2 2024-09-04 11:38:34 +02:00
DIGI_EULA DIGI_EULA: Update Digi EULA file. 2017-08-29 12:23:22 +02:00
DIGI_OPEN_EULA meta-digi-arm: Add end user license agreements. 2012-10-26 16:20:14 +02:00
README meta-digi: update support email address 2017-10-30 17:02:33 +01:00

README

OpenEmbedded/Yocto BSP layer for Digi's ConnectCore platforms
=============================================================

This layer provides support for Digi's ConnnecCore platforms for use
with OpenEmbedded and/or Yocto.

This layer depends on:

git://git.yoctoproject.org/poky.git
git://git.openembedded.org/meta-openembedded.git
git://git.yoctoproject.org/meta-freescale.git

Digi's license agreements
-------------------------

All software is covered by Digi's general EULA and Digi's Open Source
EULA. To have the right to use the software in your images you need to
read and accept both EULAs at the DIGI_EULA and DIGI_OPEN_EULA files.

NXP Semiconductors' software license agreement
----------------------------------------------

Some platforms depends on libraries and packages that are covered by
NXP Semiconductors' EULA. To have the right to use those binaries in
your images you need to read and accept the EULA file in meta-freescale
Yocto layer.

Support
-------

This layer is provided 'as is' with no guarantee. However, some support
may be available from tech.support@digi.com