meta-digi/meta-digi-arm
Gabriel Valcazar 767a3a4929 Replace bz2 rootfs tarball compression with xz compression
We tested all tarball compression formats supported by poky, and although bz2
has faster (de)compression time, xz is better in terms of compression ratio:
for all of the rootfs tarballs generated for our currently supported
images/platforms (15 at the moment), the xz format saves an average of 30 MiB
per tarball compared to bz2, totalling up to 450 MiB.

No extra dependencies are pulled in, since xz-native is already being pulled in
for all of our image builds, so the only drawback to this change is the
increased compression time (+7.34s on average per tarball).

https://onedigi.atlassian.net/browse/DEL-9459

Signed-off-by: Gabriel Valcazar <gabriel.valcazar@digi.com>
2025-01-21 11:56:31 +01:00
..
classes stm-st-stm32mp: remove outdated recipes and unnecessary files 2024-12-10 10:19:50 +01:00
conf Replace bz2 rootfs tarball compression with xz compression 2025-01-21 11:56:31 +01:00
custom-licenses kirkstone migration: cosmetic, clean build warnings 2022-06-21 16:49:56 +02:00
dynamic-layers meta-digi-arm: ccmp25-dvk: fix boot artifact names 2024-12-19 09:47:07 +01:00
recipes-bsp digi-sc-firmware: update to v1.17.0.2 2024-12-20 12:36:04 +01:00
recipes-connectivity/nxp-wlan-sdk freescale-layer: nxp-wlan-sdk: sync with meta-imx scarthgap-6.6.23-2.0.0 2024-10-17 13:03:37 +02:00
recipes-core nativesdk-packagegroup-sdk-host: only include optee dependencies when needed 2025-01-09 14:04:37 +01:00
recipes-digi trustfence-sign-artifact: fix AHAB-containerizing command for ccimx91 2024-11-20 18:57:24 +01:00
recipes-kernel linux-dey: update imx branch for release lf-6.6.52-2.2.0 2024-12-16 11:02:39 +01:00
wic sdcard: add support to create sdcard image for CCMP2 2024-09-04 11:38:34 +02:00
DIGI_EULA DIGI_EULA: Update Digi EULA file. 2017-08-29 12:23:22 +02:00
DIGI_OPEN_EULA meta-digi-arm: Add end user license agreements. 2012-10-26 16:20:14 +02:00
README meta-digi: update support email address 2017-10-30 17:02:33 +01:00

README

OpenEmbedded/Yocto BSP layer for Digi's ConnectCore platforms
=============================================================

This layer provides support for Digi's ConnnecCore platforms for use
with OpenEmbedded and/or Yocto.

This layer depends on:

git://git.yoctoproject.org/poky.git
git://git.openembedded.org/meta-openembedded.git
git://git.yoctoproject.org/meta-freescale.git

Digi's license agreements
-------------------------

All software is covered by Digi's general EULA and Digi's Open Source
EULA. To have the right to use the software in your images you need to
read and accept both EULAs at the DIGI_EULA and DIGI_OPEN_EULA files.

NXP Semiconductors' software license agreement
----------------------------------------------

Some platforms depends on libraries and packages that are covered by
NXP Semiconductors' EULA. To have the right to use those binaries in
your images you need to read and accept the EULA file in meta-freescale
Yocto layer.

Support
-------

This layer is provided 'as is' with no guarantee. However, some support
may be available from tech.support@digi.com