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Gonzalo Ruiz 84104cd0b6 firmware_qualcomm: ccimx8m: update US Board Data File calibration 
Update file:

- bdwlan30_US.bin (93a58f0f8e241bef6600d53d013c3cb2)

  This file was generated by calibrating several v3 CC8MN SOMs and
  merging their resulting BDF files into a new Golden file.
  Target output powers tables and CTL tables remain intact.

Reference calibration file is obtained from 'qca6574au-le-2-2-2_qca_oem' repo
at tag 'r00005.1' under path
'wlanfw/cnss_proc/wlan/fw/target/sdio_dst/qc6174/bdwlan30.bin':

- bdwlan30.bin (8a40d95698825e1718bee640b1f7982a)

Target output powers respect the maximum EVM for every data rate.
CTL limits comply with FCC, CE and TELEC certifications.

https://jira.digi.com/browse/DEL-7487

Signed-off-by: Gonzalo Ruiz <Gonzalo.Ruiz@digi.com>
(cherry picked from commit cceffef831edd10b017aac3006636c98f7baa0a9)
 		2021-04-06 11:24:50 +02:00
..
classes trustfence: use correct u-boot image for sdcard 2020-06-15 20:06:00 +02:00
conf machine: ccimx8mm/8mn: fix typo on device tree overlay extension 2021-03-23 10:35:02 +01:00
custom-licenses recipes-digi: add cryptoauth-openssl-engine 2018-05-09 09:16:00 +02:00
recipes-bsp firmware_qualcomm: ccimx8m: update US Board Data File calibration 2021-04-06 11:24:50 +02:00
recipes-core wireless: rework regulatory domain dependencies depending on the platform 2020-06-16 12:56:35 +02:00
recipes-cpu/m4-demos imx-m4-demos, imx-m7-demos: Update recipes to new BSP release imx_5.4.47_2.2.0 2020-11-02 22:09:08 +01:00
recipes-devtools/imx-usb-loader imx-usb-loader: use the version that was used in older versions of DEY 2019-04-04 17:42:46 +02:00
recipes-digi meta-digi: revert revisions to AUTOREV 2021-03-08 18:07:48 +01:00
recipes-kernel meta-digi: revert revisions to AUTOREV 2021-03-08 18:07:48 +01:00
recipes-security/optee-imx recipes-security: optee-imx: Update recipes to new BSP release imx_5.4.70_2.3.0 2021-02-09 15:21:36 +01:00
DIGI_EULA DIGI_EULA: Update Digi EULA file. 2017-08-29 12:23:22 +02:00
DIGI_OPEN_EULA meta-digi-arm: Add end user license agreements. 2012-10-26 16:20:14 +02:00
README meta-digi: update support email address 2017-10-30 17:02:33 +01:00

README 

OpenEmbedded/Yocto BSP layer for Digi's ConnectCore platforms
=============================================================

This layer provides support for Digi's ConnnecCore platforms for use
with OpenEmbedded and/or Yocto.

This layer depends on:

git://git.yoctoproject.org/poky.git
git://git.openembedded.org/meta-openembedded.git
git://git.yoctoproject.org/meta-freescale.git

Digi's license agreements
-------------------------

All software is covered by Digi's general EULA and Digi's Open Source
EULA. To have the right to use the software in your images you need to
read and accept both EULAs at the DIGI_EULA and DIGI_OPEN_EULA files.

NXP Semiconductors' software license agreement
----------------------------------------------

Some platforms depends on libraries and packages that are covered by
NXP Semiconductors' EULA. To have the right to use those binaries in
your images you need to read and accept the EULA file in meta-freescale
Yocto layer.

Support
-------

This layer is provided 'as is' with no guarantee. However, some support
may be available from tech.support@digi.com