meta-digi/meta-digi-arm
Gabriel Valcazar 8fad761961 ccimx6ul: install_linux_fw_uuu.sh: increase timeouts to account for large NANDs
When running the installation script on variants with larger NANDs, two of the
script's commands take longer than our intended timeouts under specific
circumstances:

    * When the variant has a NAND with 512 MiB or more and singlemtdsys is set
      to "yes", running ubivolscipt takes longer than our 10 second timeout.
      The larger the NAND storage size, the longer this command takes.
    * When the variant has a 1 GiB NAND, singlemtdsys is set to "yes" and
      dualboot is set to "no", the update of the recovery UBI volume takes
      longer than our 15 second timeout.

In both of these cases, the script fails and the installation process cannot
continue. Apply the following changes to prevent this:

    * Increase the ubivolscript timeout from 10 seconds to 30
    * Increase the recovery update timeout from 15 seconds to 20

Also, remove the command immediately before ubivolscript is run, since said
command is already being run at the beginning of ubivolscript.

https://onedigi.atlassian.net/browse/DEL-9097

Signed-off-by: Gabriel Valcazar <gabriel.valcazar@digi.com>
2024-06-27 17:48:10 +02:00
..
classes trustfence: rename variables related to FIT image signing 2024-03-19 13:26:47 +01:00
conf ccimx93-dvk: rename overlay for DLC0200CCP04DF-2 MIPI display 2024-06-24 12:29:19 +02:00
custom-licenses kirkstone migration: cosmetic, clean build warnings 2022-06-21 16:49:56 +02:00
dynamic-layers Merge branch 'dey-4.0/master' into dey-4.0/maint 2024-06-21 14:44:59 +02:00
recipes-bsp ccimx6ul: install_linux_fw_uuu.sh: increase timeouts to account for large NANDs 2024-06-27 17:48:10 +02:00
recipes-connectivity/nxp-wlan-sdk ccimx93: iw61x: update package for NXP release 6.1.55-2.2.0 2023-12-21 17:56:11 +01:00
recipes-core mount: use the ubi class to check for attached devices 2024-04-26 14:10:14 +02:00
recipes-digi Merge branch 'dey-4.0/master' into dey-4.0/maint 2024-06-21 14:44:59 +02:00
recipes-kernel kernel-module-qualcomm: add lock file to avoid endless call to script in failure 2024-06-27 11:18:11 +02:00
wic ccmp1: support different DDR3 configurations 2024-02-20 15:34:58 +01:00
DIGI_EULA DIGI_EULA: Update Digi EULA file. 2017-08-29 12:23:22 +02:00
DIGI_OPEN_EULA meta-digi-arm: Add end user license agreements. 2012-10-26 16:20:14 +02:00
README meta-digi: update support email address 2017-10-30 17:02:33 +01:00

README

OpenEmbedded/Yocto BSP layer for Digi's ConnectCore platforms
=============================================================

This layer provides support for Digi's ConnnecCore platforms for use
with OpenEmbedded and/or Yocto.

This layer depends on:

git://git.yoctoproject.org/poky.git
git://git.openembedded.org/meta-openembedded.git
git://git.yoctoproject.org/meta-freescale.git

Digi's license agreements
-------------------------

All software is covered by Digi's general EULA and Digi's Open Source
EULA. To have the right to use the software in your images you need to
read and accept both EULAs at the DIGI_EULA and DIGI_OPEN_EULA files.

NXP Semiconductors' software license agreement
----------------------------------------------

Some platforms depends on libraries and packages that are covered by
NXP Semiconductors' EULA. To have the right to use those binaries in
your images you need to read and accept the EULA file in meta-freescale
Yocto layer.

Support
-------

This layer is provided 'as is' with no guarantee. However, some support
may be available from tech.support@digi.com