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meta-digi/meta-digi-arm
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Hector Bujanda 9852058284 imx-m4-demos, imx-m7-demos: Update recipes to new BSP release imx_5.4.47_2.2.0 
Includes:
meta-imx: Remove imx sub-folder [YOCIMX-4148]

    Signed-off-by: Tom Hochstein <tom.hochstein@nxp.com>
imx-mcore-demos-2.8.inc: Correct i.MX 8DXL package name [YOCIMX-4443]
imx-mcore-demos-2.8.inc: Create inc M4/M7 recipes [YOCIMX-4443]

    Put the common functions in the inc file.

    Signed-off-by: Jun Zhu <junzhu@nxp.com>
m4-demos:  Add 8dxl back to 8dxlphantom m4

    Signed-off-by: Lauren Post <lauren.post@nxp.com>
imx-m4-demos_2.8.1.bb: Remove i.MX 8QXP version [YOCIMX-4866]
m4-demos: Upgrade to v2.8.0.1 [YOCIMX-4866]

    - imx7ulp
    - imx8mm/8mn/8mq
    - imx8qm/8qxp

    Signed-off-by: Jun Zhu <junzhu@nxp.com>
m4-demos: Upgrade i.MX 8DXL 8MP to v2.8.1 [YOCIMX-4866]
imx-m7-demos: Update imx8mn package v2.8.0.1 to EULA 1b4db4b

    Signed-off-by: i.MX Yocto Project Build <imx.build@nxp.com>

Signed-off-by: Hector Bujanda <Hector.Bujanda@digi.com>
 		2020-11-02 22:09:08 +01:00
..
classes trustfence: use correct u-boot image for sdcard 2020-06-15 20:06:00 +02:00
conf ccimx6qpsbc: add support for variants 0x02 and 0x03 2020-10-21 14:56:15 +02:00
custom-licenses recipes-digi: add cryptoauth-openssl-engine 2018-05-09 09:16:00 +02:00
recipes-bsp recipes-bsp: imx-vpu: Update recipes to new BSP release imx_5.4.47_2.2.0 2020-11-02 22:06:14 +01:00
recipes-core wireless: rework regulatory domain dependencies depending on the platform 2020-06-16 12:56:35 +02:00
recipes-cpu/m4-demos imx-m4-demos, imx-m7-demos: Update recipes to new BSP release imx_5.4.47_2.2.0 2020-11-02 22:09:08 +01:00
recipes-devtools/imx-usb-loader imx-usb-loader: use the version that was used in older versions of DEY 2019-04-04 17:42:46 +02:00
recipes-digi change recipes to build from 'master' branches 2020-10-29 12:29:48 +01:00
recipes-kernel recipes-kernel: Switch to kernel v5.4.47 2020-11-02 22:07:35 +01:00
DIGI_EULA DIGI_EULA: Update Digi EULA file. 2017-08-29 12:23:22 +02:00
DIGI_OPEN_EULA meta-digi-arm: Add end user license agreements. 2012-10-26 16:20:14 +02:00
README meta-digi: update support email address 2017-10-30 17:02:33 +01:00

README 

OpenEmbedded/Yocto BSP layer for Digi's ConnectCore platforms
=============================================================

This layer provides support for Digi's ConnnecCore platforms for use
with OpenEmbedded and/or Yocto.

This layer depends on:

git://git.yoctoproject.org/poky.git
git://git.openembedded.org/meta-openembedded.git
git://git.yoctoproject.org/meta-freescale.git

Digi's license agreements
-------------------------

All software is covered by Digi's general EULA and Digi's Open Source
EULA. To have the right to use the software in your images you need to
read and accept both EULAs at the DIGI_EULA and DIGI_OPEN_EULA files.

NXP Semiconductors' software license agreement
----------------------------------------------

Some platforms depends on libraries and packages that are covered by
NXP Semiconductors' EULA. To have the right to use those binaries in
your images you need to read and accept the EULA file in meta-freescale
Yocto layer.

Support
-------

This layer is provided 'as is' with no guarantee. However, some support
may be available from tech.support@digi.com