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Gonzalo Ruiz 82877e9840 firmware-murata: install the FCC.CE specific hcd patch 
There are two different firmware files for Bluetooth on Murata's type2AE
module:

- JRL: It configures a Bluetooth TxPower of 7dB, to be used in Japan
only.
- FCC.CE: It configures a Bluetooth TxPower of 5dB, to be used in the
rest of the world.

To comply with the FCC requirement that it should not be possible to
configure different regulatory domains, or in this case configurations,
than FCC, only deploy the FCC.CE file by default:

- BCM4373A0_FCC.CE.hcd (md5sum: 1e287a3ab7f83e59352cb321315ea80f)

This file reports the following information during boot time:

 Bluetooth: hci0: 89373 UART 37.4 MHz wlbga_BU sLNA muRata Type 2EA 5dBm 20220608-0103
 Bluetooth: hci0: BCM4373A0 (001.001.025) build 0155

JRL file will be added via the Worldwide DEY patch addon that customers
can request from Digi.

https://onedigi.atlassian.net/browse/DEL-8453

Signed-off-by: Gonzalo Ruiz <Gonzalo.Ruiz@digi.com>
 		2023-06-21 12:51:07 +02:00
..
classes trustfence: image_types: do not sign artifacts for STM platforms 2023-05-10 17:33:23 +02:00
conf firmware-sentinel: update to NXP's lf-6.1.1_1.0.0 release for ccimx93 2023-06-16 16:19:28 +02:00
custom-licenses kirkstone migration: cosmetic, clean build warnings 2022-06-21 16:49:56 +02:00
dynamic-layers optee-os: configure build platform for ccimx93 2023-06-20 13:58:46 +02:00
recipes-bsp firmware-murata: install the FCC.CE specific hcd patch 2023-06-21 12:51:07 +02:00
recipes-connectivity/nxp-wlan-sdk nxp-wlan-sdk: iw612-sdk: add nxp tools 2023-04-20 17:05:00 +02:00
recipes-core udev: dualboot: include linux_a/b to partitions to be mounted as ro 2023-06-07 16:36:54 +02:00
recipes-digi trustfence: add ccimx6qp platform to the sign tool 2023-06-20 16:46:16 +02:00
recipes-kernel linux-dey: add recipe for version 6.1 2023-06-20 13:42:33 +02:00
DIGI_EULA DIGI_EULA: Update Digi EULA file. 2017-08-29 12:23:22 +02:00
DIGI_OPEN_EULA meta-digi-arm: Add end user license agreements. 2012-10-26 16:20:14 +02:00
README meta-digi: update support email address 2017-10-30 17:02:33 +01:00

README 

OpenEmbedded/Yocto BSP layer for Digi's ConnectCore platforms
=============================================================

This layer provides support for Digi's ConnnecCore platforms for use
with OpenEmbedded and/or Yocto.

This layer depends on:

git://git.yoctoproject.org/poky.git
git://git.openembedded.org/meta-openembedded.git
git://git.yoctoproject.org/meta-freescale.git

Digi's license agreements
-------------------------

All software is covered by Digi's general EULA and Digi's Open Source
EULA. To have the right to use the software in your images you need to
read and accept both EULAs at the DIGI_EULA and DIGI_OPEN_EULA files.

NXP Semiconductors' software license agreement
----------------------------------------------

Some platforms depends on libraries and packages that are covered by
NXP Semiconductors' EULA. To have the right to use those binaries in
your images you need to read and accept the EULA file in meta-freescale
Yocto layer.

Support
-------

This layer is provided 'as is' with no guarantee. However, some support
may be available from tech.support@digi.com