meta-digi/meta-digi-arm
Gonzalo Ruiz bd31fd3ef4 firmware-murata-nxp: cc9: add rgpower files
Do not install 'txpower' and 'rutxpower' files from the Murata repo,
which are used for the V1 TX power method, and replace them with custom
'rgpower' files, required for the V2 TX power method.

These files encode the TxPower limitations obtained during the
ConnectCore 93 Certification tests, and there is one file per supported
country. There is a common file for all the European countries, so
create links for each of them, based on the CEPT REC7003E recommendation.

New 'rgpower' files:
- rgpower_CA.bin (MD5SUM: 7c012351f0521a02e3d78615fed5eb54)
- rgpower_EU.bin (MD5SUM: 4d1a54b3c1f12a7d0bb44d0337786a0b)
- rgpower_JP.bin (MD5SUM: b7706bb2718997d933b2bdf1e53e64b4)
- rgpower_US.bin (MD5SUM: 16555f962b025e0426098decd0147f1f)
- rgpower_WW.bin (MD5SUM: 505223c56527e849d4b1e5800c8613b5)

Take the opportunity to just install bt_power_config scripts and prevent
the installation of other unused files (db.txt, ed_mac_ctrl_V2_nw61x.conf
and regulatory.db) from the Murata repository.

https://onedigi.atlassian.net/browse/DEL-8974

Signed-off-by: Gonzalo Ruiz <Gonzalo.Ruiz@digi.com>
2025-07-09 10:10:13 +02:00
..
classes u-boot: drop '-dtb' from signed/encrypted image filenames 2025-07-01 18:21:13 +02:00
conf ccmp15-dvk: enable support for dey-image-flutter 2025-07-03 14:33:39 +02:00
custom-licenses kirkstone migration: cosmetic, clean build warnings 2022-06-21 16:49:56 +02:00
dynamic-layers meta-digi: revert revisions to AUTOREV 2025-07-04 11:15:42 +02:00
recipes-bsp firmware-murata-nxp: cc9: add rgpower files 2025-07-09 10:10:13 +02:00
recipes-connectivity/nxp-wlan-sdk meta-digi: remove unused nxp-wlan-sdk_git.inc file 2025-02-11 17:15:35 +01:00
recipes-core dey-toolchain: fix including machine-specific SDK tools 2025-06-06 12:30:33 +02:00
recipes-digi meta-digi: revert revisions to AUTOREV 2025-07-04 11:15:42 +02:00
recipes-kernel meta-digi: revert revisions to AUTOREV 2025-07-04 11:15:42 +02:00
wic wic: ccmp1: update TF-A and FIP artifact names to DEY-5.0 2025-06-20 20:45:14 +02:00
DIGI_EULA DIGI_EULA: Update Digi EULA file. 2017-08-29 12:23:22 +02:00
DIGI_OPEN_EULA meta-digi-arm: Add end user license agreements. 2012-10-26 16:20:14 +02:00
README meta-digi: update support email address 2017-10-30 17:02:33 +01:00

README

OpenEmbedded/Yocto BSP layer for Digi's ConnectCore platforms
=============================================================

This layer provides support for Digi's ConnnecCore platforms for use
with OpenEmbedded and/or Yocto.

This layer depends on:

git://git.yoctoproject.org/poky.git
git://git.openembedded.org/meta-openembedded.git
git://git.yoctoproject.org/meta-freescale.git

Digi's license agreements
-------------------------

All software is covered by Digi's general EULA and Digi's Open Source
EULA. To have the right to use the software in your images you need to
read and accept both EULAs at the DIGI_EULA and DIGI_OPEN_EULA files.

NXP Semiconductors' software license agreement
----------------------------------------------

Some platforms depends on libraries and packages that are covered by
NXP Semiconductors' EULA. To have the right to use those binaries in
your images you need to read and accept the EULA file in meta-freescale
Yocto layer.

Support
-------

This layer is provided 'as is' with no guarantee. However, some support
may be available from tech.support@digi.com