meta-digi/meta-digi-arm
Javier Viguera c8a33e8de9 imx-boot: fix build of imx-boot artifacts
Recently, meta-freescale backported the support to build multiple boot
artifacts. This clashes with the changes in our imx-boot bbappend,
so update the bbappend to make it compatible with the latest changes
in meta-freescale.

Signed-off-by: Javier Viguera <javier.viguera@digi.com>
(cherry picked from commit 2fd1dbfed7)
2023-10-10 14:13:37 +02:00
..
classes trustfence: decouple signing external artifacts 2023-09-25 14:23:40 +02:00
conf ccmp1: don't build additional UBI/UBIFS images via meta-st-stm32mp layer 2023-10-09 15:37:16 +02:00
custom-licenses kirkstone migration: cosmetic, clean build warnings 2022-06-21 16:49:56 +02:00
dynamic-layers imx-boot: fix build of imx-boot artifacts 2023-10-10 14:13:37 +02:00
recipes-bsp trustfence-stm-signtools: rework package so that the tools are accessible 2023-10-09 15:36:58 +02:00
recipes-connectivity/nxp-wlan-sdk nxp-wlan-sdk: update to version lf-6.1.22 2023-07-07 02:04:16 +02:00
recipes-core nativesdk: add STM signtools to SDK 2023-10-09 15:36:44 +02:00
recipes-digi nativesdk: add STM signtools to SDK 2023-10-09 15:36:44 +02:00
recipes-kernel trustfence: decouple signing external artifacts 2023-09-25 14:23:40 +02:00
wic ccmp1: add wks file to generate a bootable sdcard 2023-07-31 11:51:16 +02:00
DIGI_EULA DIGI_EULA: Update Digi EULA file. 2017-08-29 12:23:22 +02:00
DIGI_OPEN_EULA meta-digi-arm: Add end user license agreements. 2012-10-26 16:20:14 +02:00
README meta-digi: update support email address 2017-10-30 17:02:33 +01:00

README

OpenEmbedded/Yocto BSP layer for Digi's ConnectCore platforms
=============================================================

This layer provides support for Digi's ConnnecCore platforms for use
with OpenEmbedded and/or Yocto.

This layer depends on:

git://git.yoctoproject.org/poky.git
git://git.openembedded.org/meta-openembedded.git
git://git.yoctoproject.org/meta-freescale.git

Digi's license agreements
-------------------------

All software is covered by Digi's general EULA and Digi's Open Source
EULA. To have the right to use the software in your images you need to
read and accept both EULAs at the DIGI_EULA and DIGI_OPEN_EULA files.

NXP Semiconductors' software license agreement
----------------------------------------------

Some platforms depends on libraries and packages that are covered by
NXP Semiconductors' EULA. To have the right to use those binaries in
your images you need to read and accept the EULA file in meta-freescale
Yocto layer.

Support
-------

This layer is provided 'as is' with no guarantee. However, some support
may be available from tech.support@digi.com