meta-digi/meta-digi-arm
Gabriel Valcazar d13b42492f Rework ccimx8x imx-boot/u-boot recipes to reduce number of imx-boot artifacts
Now that both U-Boot and the SCFW can autodetect the RAM configuration, we can
simplify the imx-boot build process to generate two binaries (one per SOC
revision) instead of eight. Build "flash_spl" imx-boot images and use only one
global defconfig for u-boot.

Signed-off-by: Gabriel Valcazar <gabriel.valcazar@digi.com>
2023-06-30 15:00:25 +02:00
..
classes trustfence: image_types: do not sign artifacts for STM platforms 2023-05-10 17:33:23 +02:00
conf Rework ccimx8x imx-boot/u-boot recipes to reduce number of imx-boot artifacts 2023-06-30 15:00:25 +02:00
custom-licenses kirkstone migration: cosmetic, clean build warnings 2022-06-21 16:49:56 +02:00
dynamic-layers Rework ccimx8x imx-boot/u-boot recipes to reduce number of imx-boot artifacts 2023-06-30 15:00:25 +02:00
recipes-bsp Rework ccimx8x imx-boot/u-boot recipes to reduce number of imx-boot artifacts 2023-06-30 15:00:25 +02:00
recipes-connectivity/nxp-wlan-sdk nxp-wlan-sdk: iw612-sdk: add nxp tools 2023-04-20 17:05:00 +02:00
recipes-core udev: dualboot: include linux_a/b to partitions to be mounted as ro 2023-06-07 16:36:54 +02:00
recipes-digi trustfence: add ccimx6qp platform to the sign tool 2023-06-20 16:46:16 +02:00
recipes-kernel linux-dey-5.15: add support for ccimx8x 2023-06-29 16:24:29 +02:00
DIGI_EULA DIGI_EULA: Update Digi EULA file. 2017-08-29 12:23:22 +02:00
DIGI_OPEN_EULA meta-digi-arm: Add end user license agreements. 2012-10-26 16:20:14 +02:00
README meta-digi: update support email address 2017-10-30 17:02:33 +01:00

README

OpenEmbedded/Yocto BSP layer for Digi's ConnectCore platforms
=============================================================

This layer provides support for Digi's ConnnecCore platforms for use
with OpenEmbedded and/or Yocto.

This layer depends on:

git://git.yoctoproject.org/poky.git
git://git.openembedded.org/meta-openembedded.git
git://git.yoctoproject.org/meta-freescale.git

Digi's license agreements
-------------------------

All software is covered by Digi's general EULA and Digi's Open Source
EULA. To have the right to use the software in your images you need to
read and accept both EULAs at the DIGI_EULA and DIGI_OPEN_EULA files.

NXP Semiconductors' software license agreement
----------------------------------------------

Some platforms depends on libraries and packages that are covered by
NXP Semiconductors' EULA. To have the right to use those binaries in
your images you need to read and accept the EULA file in meta-freescale
Yocto layer.

Support
-------

This layer is provided 'as is' with no guarantee. However, some support
may be available from tech.support@digi.com