meta-digi/meta-digi-arm
Gabriel Valcazar 99134ca87c imx-digi-base.inc: Set generic tuning for i.MX8/i.MX9
This replicates meta-imx commit addc08b02f9a, which was added to be able to
re-use packages in i.MX8/i.MX9 builds. Without this change, there are
compilation errors when building recent versions of the onnxruntime package
because some .S files are built with specific -march switches that conflict
with our current tunings. For example, when building for the ccimx8x-sbc-pro:

    cc1: error: switch '-mcpu=cortex-a35+crc+crypto' conflicts with '-march=armv8.2-a+fp16' switch [-Werror]
    [...]HalfGemmKernelNeon.S:151: Error: selected processor does not support `fmla v20.8h,v16.8h,v0.h[0]'

Using the generic tuning solves this issue, and according to the log in the
original meta-imx commit, this has minimal to no impact on binaries, so use
said tuning in all relevant platforms.

Signed-off-by: Gabriel Valcazar <gabriel.valcazar@digi.com>
2025-01-07 13:09:28 +01:00
..
classes stm-st-stm32mp: remove outdated recipes and unnecessary files 2024-12-10 10:19:50 +01:00
conf imx-digi-base.inc: Set generic tuning for i.MX8/i.MX9 2025-01-07 13:09:28 +01:00
custom-licenses kirkstone migration: cosmetic, clean build warnings 2022-06-21 16:49:56 +02:00
dynamic-layers meta-digi-arm: ccmp25-dvk: fix boot artifact names 2024-12-19 09:47:07 +01:00
recipes-bsp digi-sc-firmware: update to v1.17.0.2 2024-12-20 12:36:04 +01:00
recipes-connectivity/nxp-wlan-sdk freescale-layer: nxp-wlan-sdk: sync with meta-imx scarthgap-6.6.23-2.0.0 2024-10-17 13:03:37 +02:00
recipes-core Update Digi Copyright header 2024-07-15 09:28:58 +02:00
recipes-digi trustfence-sign-artifact: fix AHAB-containerizing command for ccimx91 2024-11-20 18:57:24 +01:00
recipes-kernel linux-dey: update imx branch for release lf-6.6.52-2.2.0 2024-12-16 11:02:39 +01:00
wic sdcard: add support to create sdcard image for CCMP2 2024-09-04 11:38:34 +02:00
DIGI_EULA DIGI_EULA: Update Digi EULA file. 2017-08-29 12:23:22 +02:00
DIGI_OPEN_EULA meta-digi-arm: Add end user license agreements. 2012-10-26 16:20:14 +02:00
README meta-digi: update support email address 2017-10-30 17:02:33 +01:00

README

OpenEmbedded/Yocto BSP layer for Digi's ConnectCore platforms
=============================================================

This layer provides support for Digi's ConnnecCore platforms for use
with OpenEmbedded and/or Yocto.

This layer depends on:

git://git.yoctoproject.org/poky.git
git://git.openembedded.org/meta-openembedded.git
git://git.yoctoproject.org/meta-freescale.git

Digi's license agreements
-------------------------

All software is covered by Digi's general EULA and Digi's Open Source
EULA. To have the right to use the software in your images you need to
read and accept both EULAs at the DIGI_EULA and DIGI_OPEN_EULA files.

NXP Semiconductors' software license agreement
----------------------------------------------

Some platforms depends on libraries and packages that are covered by
NXP Semiconductors' EULA. To have the right to use those binaries in
your images you need to read and accept the EULA file in meta-freescale
Yocto layer.

Support
-------

This layer is provided 'as is' with no guarantee. However, some support
may be available from tech.support@digi.com