meta-digi/meta-digi-arm
Arturo Buzarra ecd77dece9 firmware-murata: update firmware binaries to version imx-kirkstone-hedorah_r1.0
This commit updates the required firmware binaries for Bluetooth and Wireless
interfaces, hostapd and wpa_supplicant recipes based on the Cypress Linux WiFi
Driver (FMAC) release v5.15.58-2023_1128 (Wireless firmware v13.10.246.334).
This change also includes a custom defconfig file for the hostapd and
wpa_supplicant recipes including the changes from the patches and the Digi
customizations.

Also are updated the Murata firmware repositories to match with the latest
Murata release imx-kirkstone-hedorah_r1.0, which is based in the same Cypress
Linux Wifi Driver release v5.15.58-2023_1128.

https://onedigi.atlassian.net/browse/DEL-8667

Signed-off-by: Arturo Buzarra <arturo.buzarra@digi.com>
2024-03-18 18:13:09 +01:00
..
classes meta-digi: trustfence: support signing a FIT boot artifact 2024-03-12 18:13:05 +01:00
conf meta-digi: trustfence: support signing a FIT boot artifact 2024-03-12 18:13:05 +01:00
custom-licenses kirkstone migration: cosmetic, clean build warnings 2022-06-21 16:49:56 +02:00
dynamic-layers Merge tag 'dey-4.0-r5.2' into dey-4.0/master 2024-02-16 12:59:43 +01:00
recipes-bsp firmware-murata: update firmware binaries to version imx-kirkstone-hedorah_r1.0 2024-03-18 18:13:09 +01:00
recipes-connectivity/nxp-wlan-sdk ccimx93: iw61x: update package for NXP release 6.1.55-2.2.0 2023-12-21 17:56:11 +01:00
recipes-core read only: fix problem when mounting external devices 2024-01-09 16:36:20 +01:00
recipes-digi meta-digi: support SRK revocation mask when signing boot artifacts 2024-03-12 18:12:56 +01:00
recipes-kernel meta-digi: trustfence: support signing a FIT boot artifact 2024-03-12 18:13:05 +01:00
wic ccmp1: support different DDR3 configurations 2024-02-20 15:34:58 +01:00
DIGI_EULA DIGI_EULA: Update Digi EULA file. 2017-08-29 12:23:22 +02:00
DIGI_OPEN_EULA meta-digi-arm: Add end user license agreements. 2012-10-26 16:20:14 +02:00
README meta-digi: update support email address 2017-10-30 17:02:33 +01:00

README

OpenEmbedded/Yocto BSP layer for Digi's ConnectCore platforms
=============================================================

This layer provides support for Digi's ConnnecCore platforms for use
with OpenEmbedded and/or Yocto.

This layer depends on:

git://git.yoctoproject.org/poky.git
git://git.openembedded.org/meta-openembedded.git
git://git.yoctoproject.org/meta-freescale.git

Digi's license agreements
-------------------------

All software is covered by Digi's general EULA and Digi's Open Source
EULA. To have the right to use the software in your images you need to
read and accept both EULAs at the DIGI_EULA and DIGI_OPEN_EULA files.

NXP Semiconductors' software license agreement
----------------------------------------------

Some platforms depends on libraries and packages that are covered by
NXP Semiconductors' EULA. To have the right to use those binaries in
your images you need to read and accept the EULA file in meta-freescale
Yocto layer.

Support
-------

This layer is provided 'as is' with no guarantee. However, some support
may be available from tech.support@digi.com