meta-digi/meta-digi-arm
Gonzalo Ruiz f0b588255e firmware-atheros: add optimized board data files for new AR6233 on CC6
New AR6233 chips from Qualcomm require a power reduction in the 2.4GHz
band to maintain a good EVM.

Generate new board data files with this optimized target power
configuration, but do not replace the original board data files so this
change does not affect CC6 modules with the original AR6233 chip.

The new AR6233 will be populated in modules with Hardware Version=6 or
higher. Load one board data file or the other based on the Hardware
Version field of the HWID via a post-installation script.

Board data files with optimized TX Power ('b' files):
- Digi_6203-6233-US_b.bin (MD5SUM: 53db0fba1eea22d5c7248b35669234bd)
- Digi_6203-6233-World_b.bin (MD5SUM: 307ea9e9364c46a243a36124c92cddc2)
- Digi_6203_2_ANT-US_b.bin (MD5SUM: 741f69584f43258ec15bfccaebdb8896)
- Digi_6203_2_ANT-World_b.bin (MD5SUM: 9f89d081aaef7f26292d42ad193c188d)

https://onedigi.atlassian.net/browse/DEL-8851

Signed-off-by: Gonzalo Ruiz <Gonzalo.Ruiz@digi.com>
2024-01-29 16:39:56 +01:00
..
classes ccimx6ul/ccmp1: compress recovery UBIFS image using zlib to reduce its size 2024-01-04 11:24:20 +01:00
conf trustfence-sign-tools: new recipe based on u-boot v2023.04 2024-01-26 11:58:04 +01:00
custom-licenses kirkstone migration: cosmetic, clean build warnings 2022-06-21 16:49:56 +02:00
dynamic-layers Merge branch 'dey-4.0/master' into dey-4.0/maint 2024-01-19 11:46:55 +01:00
recipes-bsp firmware-atheros: add optimized board data files for new AR6233 on CC6 2024-01-29 16:39:56 +01:00
recipes-connectivity/nxp-wlan-sdk ccimx93: iw61x: update package for NXP release 6.1.55-2.2.0 2023-12-21 17:56:11 +01:00
recipes-core read only: fix problem when mounting external devices 2024-01-09 16:36:20 +01:00
recipes-digi trustfence-sign-tools: new recipe based on u-boot v2023.04 2024-01-26 11:58:04 +01:00
recipes-kernel Merge branch 'dey-4.0/master' into dey-4.0/maint 2024-01-19 11:46:55 +01:00
wic ccmp1: add wks file to generate a bootable sdcard 2023-07-31 11:51:16 +02:00
DIGI_EULA DIGI_EULA: Update Digi EULA file. 2017-08-29 12:23:22 +02:00
DIGI_OPEN_EULA meta-digi-arm: Add end user license agreements. 2012-10-26 16:20:14 +02:00
README meta-digi: update support email address 2017-10-30 17:02:33 +01:00

README

OpenEmbedded/Yocto BSP layer for Digi's ConnectCore platforms
=============================================================

This layer provides support for Digi's ConnnecCore platforms for use
with OpenEmbedded and/or Yocto.

This layer depends on:

git://git.yoctoproject.org/poky.git
git://git.openembedded.org/meta-openembedded.git
git://git.yoctoproject.org/meta-freescale.git

Digi's license agreements
-------------------------

All software is covered by Digi's general EULA and Digi's Open Source
EULA. To have the right to use the software in your images you need to
read and accept both EULAs at the DIGI_EULA and DIGI_OPEN_EULA files.

NXP Semiconductors' software license agreement
----------------------------------------------

Some platforms depends on libraries and packages that are covered by
NXP Semiconductors' EULA. To have the right to use those binaries in
your images you need to read and accept the EULA file in meta-freescale
Yocto layer.

Support
-------

This layer is provided 'as is' with no guarantee. However, some support
may be available from tech.support@digi.com