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Hector Palacios f58ccb7463 boot: don't set fdt_file on bootscript; just the overlays 
With the device tree overlays mechanism in place, the bootscript
doesn't need to set the fdt_file variable. Instead, it will use
the value it has (which can be changed by the user) and it will
simply update the 'overlays' variable with the device tree
overlays that apply basing on the hardware capabilities found
on the HWID, SOM version, and carrier board version.

This allows a user to override the default fdt_file to point
to his custom device tree, but still make use of the boot script
for hardware-detected overlays.

Without the need to set the base filename, the boot script is the
same for any carrier board of the ccimx8x SOM, so this commit
moves it to a common folder.

Signed-off-by: Hector Palacios <hector.palacios@digi.com>
 		2020-05-27 07:06:29 +02:00
..
classes trustfence: Export variables that are needed by sign tools. 2020-02-12 18:50:19 +01:00
conf ccimx8x: add support for QXP overlay 2020-05-26 12:25:18 +02:00
custom-licenses recipes-digi: add cryptoauth-openssl-engine 2018-05-09 09:16:00 +02:00
recipes-bsp boot: don't set fdt_file on bootscript; just the overlays 2020-05-27 07:06:29 +02:00
recipes-core zeus migration: packagegroup-base: remove wireless-regdb-static package dependency 2020-05-04 15:09:37 +02:00
recipes-cpu/m4-demos imx-m4-demos: sync with meta-fsl-bsp-release branch sumo-4.14.98-2.3.0 2020-01-16 13:27:54 +01:00
recipes-devtools/imx-usb-loader imx-usb-loader: use the version that was used in older versions of DEY 2019-04-04 17:42:46 +02:00
recipes-digi trustfence: Add U-Boot sign support for ccimx8mn 2020-04-08 14:23:18 +02:00
recipes-kernel linux-libc-headers: refresh patch to add Digi debounce IOCTL to kernel v5.4 2020-05-04 15:09:37 +02:00
DIGI_EULA DIGI_EULA: Update Digi EULA file. 2017-08-29 12:23:22 +02:00
DIGI_OPEN_EULA meta-digi-arm: Add end user license agreements. 2012-10-26 16:20:14 +02:00
README meta-digi: update support email address 2017-10-30 17:02:33 +01:00

README 

OpenEmbedded/Yocto BSP layer for Digi's ConnectCore platforms
=============================================================

This layer provides support for Digi's ConnnecCore platforms for use
with OpenEmbedded and/or Yocto.

This layer depends on:

git://git.yoctoproject.org/poky.git
git://git.openembedded.org/meta-openembedded.git
git://git.yoctoproject.org/meta-freescale.git

Digi's license agreements
-------------------------

All software is covered by Digi's general EULA and Digi's Open Source
EULA. To have the right to use the software in your images you need to
read and accept both EULAs at the DIGI_EULA and DIGI_OPEN_EULA files.

NXP Semiconductors' software license agreement
----------------------------------------------

Some platforms depends on libraries and packages that are covered by
NXP Semiconductors' EULA. To have the right to use those binaries in
your images you need to read and accept the EULA file in meta-freescale
Yocto layer.

Support
-------

This layer is provided 'as is' with no guarantee. However, some support
may be available from tech.support@digi.com