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meta-digi/meta-digi-arm
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Hector Palacios ae327e8dae trustfence: stm: move generation of PKI out of sign script 
Create a new script for the generation of PKI tree for STM platforms
and leave the trustfence-sign-artifact script exclusively for signing.
The new gen-pki script only requires the platform as an argument and the
path to where to save the tree (if it doesn't exist) in
CONFIG_SIGN_KEYS_PATH.

This commit also reverts commit 13c136dbc5 by getting rid of the
trustfence-genpki-native.bb recipe and moving back the PKI generation
functions into trustfence.bbclass. This recipe didn't quite guarantee
that the PKI was generated on time for the recipes that required the
keys to exist, anyway.
Instead, the PKI generation function must be called right after
do_compile() of recipe tf-a-stm32mp to be ready for do_deploy() where
the key is used.

Signed-off-by: Hector Palacios <hector.palacios@digi.com>
 		2023-08-14 09:19:16 +02:00
..
classes image_types.bbclass: do not try to sign rootfs image for ccmp1x family 2023-08-10 09:04:56 +02:00
conf ccmp1x: create new variable to be able to truly override TF_A_CONFIG 2023-08-03 15:17:03 +02:00
custom-licenses kirkstone migration: cosmetic, clean build warnings 2022-06-21 16:49:56 +02:00
dynamic-layers trustfence: stm: move generation of PKI out of sign script 2023-08-14 09:19:16 +02:00
recipes-bsp sound: max98088: update card name 2023-08-08 10:29:16 +02:00
recipes-connectivity/nxp-wlan-sdk nxp-wlan-sdk: update to version lf-6.1.22 2023-07-07 02:04:16 +02:00
recipes-core meta-digi-arm: udev: mount_digiparts: minor script syntax fix 2023-08-02 10:22:13 +02:00
recipes-digi trustfence: stm: move generation of PKI out of sign script 2023-08-14 09:19:16 +02:00
recipes-kernel kernel-module-nxp-wlan: fix HE Rate Index warning 2023-08-01 18:56:54 +02:00
wic ccmp1: add wks file to generate a bootable sdcard 2023-07-31 11:51:16 +02:00
DIGI_EULA DIGI_EULA: Update Digi EULA file. 2017-08-29 12:23:22 +02:00
DIGI_OPEN_EULA meta-digi-arm: Add end user license agreements. 2012-10-26 16:20:14 +02:00
README meta-digi: update support email address 2017-10-30 17:02:33 +01:00

README 

OpenEmbedded/Yocto BSP layer for Digi's ConnectCore platforms
=============================================================

This layer provides support for Digi's ConnnecCore platforms for use
with OpenEmbedded and/or Yocto.

This layer depends on:

git://git.yoctoproject.org/poky.git
git://git.openembedded.org/meta-openembedded.git
git://git.yoctoproject.org/meta-freescale.git

Digi's license agreements
-------------------------

All software is covered by Digi's general EULA and Digi's Open Source
EULA. To have the right to use the software in your images you need to
read and accept both EULAs at the DIGI_EULA and DIGI_OPEN_EULA files.

NXP Semiconductors' software license agreement
----------------------------------------------

Some platforms depends on libraries and packages that are covered by
NXP Semiconductors' EULA. To have the right to use those binaries in
your images you need to read and accept the EULA file in meta-freescale
Yocto layer.

Support
-------

This layer is provided 'as is' with no guarantee. However, some support
may be available from tech.support@digi.com