meta-digi/meta-digi-arm
Arturo Buzarra 76a4f781e3 stm-st-stm32mp: fip-stm32mp: add OP-TEE USB FIP configuration
The FIP flavor for OP-TEE + USB is managed in the meta-st-stm32mp layer through
the "optee-programmer-usb". However, since we do not require the additional
overhead introduced by the STM32CubeProgrammer tool, this commit introduces a
new FIP configuration based on OP-TEE for booting from USB.

https://onedigi.atlassian.net/browse/DEL-9442

Signed-off-by: Arturo Buzarra <arturo.buzarra@digi.com>
2025-03-21 08:55:07 +01:00
..
classes stm-st-stm32mp: remove outdated recipes and unnecessary files 2024-12-10 10:19:50 +01:00
conf stm-st-stm32mp: fip-stm32mp: add OP-TEE USB FIP configuration 2025-03-21 08:55:07 +01:00
custom-licenses kirkstone migration: cosmetic, clean build warnings 2022-06-21 16:49:56 +02:00
dynamic-layers stm-st-stm32mp: fip-stm32mp: add OP-TEE USB FIP configuration 2025-03-21 08:55:07 +01:00
recipes-bsp trustfence-stm-signtools: update recipe and package to binaries v2.19.0 2025-03-21 08:55:07 +01:00
recipes-connectivity/nxp-wlan-sdk meta-digi: remove unused nxp-wlan-sdk_git.inc file 2025-02-11 17:15:35 +01:00
recipes-core Revert "crank: recipe for crank demos" 2025-03-10 12:51:55 +01:00
recipes-digi Merge tag 'dey-5.0-r1.3' into dey-5.0/master 2025-03-10 11:26:31 +01:00
recipes-kernel meta-digi: move ccimx8m platforms support to kernel 6.6 2025-03-19 10:26:06 +01:00
wic ccmp2: fix wks file to generate a bootable sdcard 2025-02-19 09:27:43 +01:00
DIGI_EULA DIGI_EULA: Update Digi EULA file. 2017-08-29 12:23:22 +02:00
DIGI_OPEN_EULA meta-digi-arm: Add end user license agreements. 2012-10-26 16:20:14 +02:00
README meta-digi: update support email address 2017-10-30 17:02:33 +01:00

README

OpenEmbedded/Yocto BSP layer for Digi's ConnectCore platforms
=============================================================

This layer provides support for Digi's ConnnecCore platforms for use
with OpenEmbedded and/or Yocto.

This layer depends on:

git://git.yoctoproject.org/poky.git
git://git.openembedded.org/meta-openembedded.git
git://git.yoctoproject.org/meta-freescale.git

Digi's license agreements
-------------------------

All software is covered by Digi's general EULA and Digi's Open Source
EULA. To have the right to use the software in your images you need to
read and accept both EULAs at the DIGI_EULA and DIGI_OPEN_EULA files.

NXP Semiconductors' software license agreement
----------------------------------------------

Some platforms depends on libraries and packages that are covered by
NXP Semiconductors' EULA. To have the right to use those binaries in
your images you need to read and accept the EULA file in meta-freescale
Yocto layer.

Support
-------

This layer is provided 'as is' with no guarantee. However, some support
may be available from tech.support@digi.com