meta-digi/meta-digi-arm
Arturo Buzarra d86857e804 stm-st-stm32mp: tf-a-stm32mp: Add custom export_binaries() to fix TF-A artifact deployment
This commit introduces a custom export_binaries() function to resolve a
deployment issue affecting the final TF-A artifact path. The issue occurs when
the SoC name does not match the TF-A device tree name.

This fix is required due to changes introduced in commit f0b4d0d02a
("ccmp15: enable secure_system_service for CCMP15"), which modified the TF-A
artifact generation process.

https://onedigi.atlassian.net/browse/DEL-9734

Signed-off-by: Arturo Buzarra <arturo.buzarra@digi.com>
2025-07-29 14:12:36 +02:00
..
classes u-boot: drop '-dtb' from signed/encrypted image filenames 2025-07-01 18:21:13 +02:00
conf stm-st-stm32mp: fip/tf-a: sync .bbappend recipes with ST BSP v25.06.11 release 2025-07-29 11:33:15 +02:00
custom-licenses kirkstone migration: cosmetic, clean build warnings 2022-06-21 16:49:56 +02:00
dynamic-layers stm-st-stm32mp: tf-a-stm32mp: Add custom export_binaries() to fix TF-A artifact deployment 2025-07-29 14:12:36 +02:00
recipes-bsp Merge tag 'dey-5.0-r2.2' into dey-5.0/master 2025-07-21 16:12:18 +02:00
recipes-connectivity/nxp-wlan-sdk meta-digi: remove unused nxp-wlan-sdk_git.inc file 2025-02-11 17:15:35 +01:00
recipes-core dey-toolchain: fix including machine-specific SDK tools 2025-06-06 12:30:33 +02:00
recipes-digi trustfence-sign-artifact: fix kernel load address for u-boot v2024 2025-04-04 11:15:29 +02:00
recipes-kernel linux-dey-6.6: update STM branch for release v6.6-stm32mp-r2 2025-07-28 10:58:55 +02:00
wic wic: ccmp1: update TF-A and FIP artifact names to DEY-5.0 2025-06-20 20:45:14 +02:00
DIGI_EULA DIGI_EULA: Update Digi EULA file. 2017-08-29 12:23:22 +02:00
DIGI_OPEN_EULA meta-digi-arm: Add end user license agreements. 2012-10-26 16:20:14 +02:00
README meta-digi: update support email address 2017-10-30 17:02:33 +01:00

README

OpenEmbedded/Yocto BSP layer for Digi's ConnectCore platforms
=============================================================

This layer provides support for Digi's ConnnecCore platforms for use
with OpenEmbedded and/or Yocto.

This layer depends on:

git://git.yoctoproject.org/poky.git
git://git.openembedded.org/meta-openembedded.git
git://git.yoctoproject.org/meta-freescale.git

Digi's license agreements
-------------------------

All software is covered by Digi's general EULA and Digi's Open Source
EULA. To have the right to use the software in your images you need to
read and accept both EULAs at the DIGI_EULA and DIGI_OPEN_EULA files.

NXP Semiconductors' software license agreement
----------------------------------------------

Some platforms depends on libraries and packages that are covered by
NXP Semiconductors' EULA. To have the right to use those binaries in
your images you need to read and accept the EULA file in meta-freescale
Yocto layer.

Support
-------

This layer is provided 'as is' with no guarantee. However, some support
may be available from tech.support@digi.com